BL-R8801MS1
IEEE 802.11b/g/n WLAN SDIO Module
Content
Content.1
0.Revision History.2
1. General Description.2
2.The range of applying.2
3. Product Specification.2
3.1 Function Block diagram..2
3.2 Electrical and Performance Specification.3
3.3 Product Photo.4
3.4 Mechanical Specification.5
3.5 Product Pin Definition.5
4. Supported platform..7
4.1 DC characteristics.7
4.2 RF Characteristic.8
5. Peripheral Schematic Reference Design.8
6. Typical Solder Reflow Profile.8
7. Package Information.9
8. Precautions for use
1. General Description
YK-EMW1088product is designed base on MARVELL 88W8801 chipset .It is a highly integrated single-band (2.4GHz) IEEE 802.11n 1X1 System-on-Chip (SoC), specifically designed to support High Throughput data rates for next generation WLAN products. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily .
- 2. The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.
3.Product Specification
3.1 Function Block diagram
3.2 Electrical and Performance Specification
Item
Description
Product Name
YK-EMW1088
Major Chipset
MARVELL 88W8801
Host Interface
SDIO
Standard
IEEE 802.11b, IEEE 802.11g,IEEE 802.11n,
Frequency Range
2.4GHz~2.4835GHz
Modulation Type
802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n: 64-QAM,16-QAM, QPSK, BPSK
Working Mode
Infrastructure, Ad-Hoc
Data Transfer Rate
1,2,5.5,6,11,12,18,22,24,30,36,48,54,and maximum of 72.2Mbps
Spread Spectrum
IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Multiplexing)
Sensitivity @PER
1M:-92dBm@8%PER
6M:-89dBm@10%PER
11M:-88dBm@8%PER
54M:-73dBm@10%PER
72.2M:- 70dBm@10%PER
RF Power
17dBm@11b,14dBm@11g ,13dBm@11n
Antenna type
Connect to the external antenna through the IPEX connector
The transmit distance
Indoor 100M, Outdoor 300M, according the local environment
Dimension(L*W*H)
20 x 12.5 x 2.65mm (LxWxH) ;Tolerance: +-0.15mm
Power supply
3.3V +/-0.2V
Power Consumption
standby mode 70mA@3.3V ,
TX mode 150mA@3.3V
Clock source
38.4MHz
Working Temperature
-20°C to +85°C
Storage temperature
-55°C ~ +125°C
3.3 Product Photo
TOP Bottom
3.4 Mechanical Specification
Module dimension: Typical (L x W x H): 20mmx12.5mmx2.65mm Tolerance : +/-0.15mm
Shielding dimension Typical (L x W x H): 14.7mmx10.48mmx2mm Tolerance : +/-0.1mm
3.5 Product Pin Definition
Function
Description
ANT_RF
WLAN RF pad
GND
Ground
VCC3
3.3V power supply
NC
NC
WK_OUT
Wake/Suspend output control
WK_IN
Wake/Suspend input control
PD_n
Power down (active low)
SD _2
SDIO data 2
SD _3
SDIO data 3 /GSPI chip select
SD _CMD
SDIO command/GSPI data input
SD _CLK
SDIO clock /GSPI clock
SD _D0
SDIO data 0 /GSPI data output
SD _D1
SDIO data 1 /GSPI data out
4. Supported platform
Support Linux platform.
4.1 DC characteristics
Terms
Contents
Specification : IEEE802.11b
Mode
DSSS / CCK
Frequency
2412 – 2484MHz
Data rate
1, 2, 5.5, 11Mbps
DC Characteristics
min
Typ.
max.
unit
TX mode
140
151
160
mA
Rx mode
70
72
75
mA
Sleep mode
65
66
68
mA
Specification : IEEE802.11g
Mode
OFDM
Frequency
2412 - 2484MHz
Data rate
6, 9, 12, 18, 24, 36, 48, 54Mbps
DC Characteristics
min
Typ.
max.
unit
TX mode
90
95
150
mA
Rx mode
72
73
75
mA
Sleep mode
65
66
68
mA
Specification : IEEE802.11n
Mode
OFDM
Frequency
2412 - 2484MHz
Data rate
6.5, 13, 19.5, 26, 39, 52, 58.5, 72.2Mbps
DC Characteristics
min
Typ.
max.
unit
TX mode
72
75
140
mA
Rx mode
70
73
78
mA
Sleep mode
65
66
68
mA
4.2 RF Characteristic
Mode
Rate(Mbps)
Power(dBm)
EVM(dB)
Sensitivity(dBm)
CH1
CH7
CH13
CH1
CH7
CH13
CH1
CH7
CH13
11b
1
17.02
17.37
16.85
-39.37
-37.29
-38.79
-93
-93
-93
11
16.98
17.41
16.61
-39.49
-39.06
-39.57
-88
-88
-88
11g
6
15.97
16.04
15.71
-23.36
-20.66
-20.34
-89
-89
-89
54
15.28
15.07
14.49
-32.51
-31.98
-32.75
-73
-73
-73
11n
HT20
MCS0
13.88
13.68
13.16
-26.61
-24.31
-24.90
-86
-86
-86
MCS7
13.65
14.00
13.38
-34.66
-31.8
-32.96
-70
-70
-70
5. Peripheral Schematic Reference Design
a: The RF trace need to keep 50ohm impedance. Pls reserve a “pi” circuit for antenna matching if use the half hole antenna pad..
b: Pls pull low if need to use PDN function. Otherwise host need to drive this pin high for normal operation.
c: Pls keep the SDIO lines as equal as possible, minimize the trace length between host and module. Make sure that all SDIO traces have a good ground reference.
6. Typical Solder Reflow Profile
7. Package Information
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4.Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.
"};
